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EASy-Producer
Subtitle
An Open Toolset for Lightweight Product Line Engineering
Publication Type
ConferencePaper
Author
Schmid, Klaus
Date Issued
2017
Faculty
Fachbereich 4
Institute / Institution
Institut für Informatik
Conference
Embedded World Conference, Nürnberg, 14.03.-17.03.2017
HilPub short link
https://hilpub.uni-hildesheim.de/handle/ubhi/14256
